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Keyword "wafer"

Wafer Card Programmer (05/15/2006)
Specifications: Wafer card programmer Specifications System requirement ibm pc compatible. Usb port Operation system win 98/win 2000/win me/win xp Usb usb(12mb/sec) cable 2m Power requirement dc +5v from usb cable Dimensions 110(l) *65(w) *30(h) User interface china. English. Korean R/w: At90s8515a At90s2323 At90s2343 At90s8535 At mega161 At mega163 Pic16f84 Pic16f627 Pic 16f628 Pic 16f876

[Related Categories: IC Card ]
[Related Keywords: wafer, card, programmer ]

Gold Wafer Card (05/28/2006)
Specifications: The gold wafer card is an 8 bit, field programmable, iso-7816 compatible multi-chip smart card featuring the microchip technology, inc. Pic16f84 + 24lc16 die. Fully compatible with similar products on the market, the card is supported by a number of commercially available programmers. The card features an expanded data memory and is ideally suited for applications Requiring field programming and reprogramming, short time to market and small to Medium volume roll outs. Features: Iso 7816-1 compatible pin-out Iso 7816-1 compatible card body Single 5v operation Dc to 10~20mhz operating speed Dc to 400 nano second instruction cycle Harvard architecture 35 word single word risc instructions Re-programmable with code protection 　 1024 x 14 on-chip program momery 64 x 8 internal eeprom memory 16k x 8 expanded eeprom memory Enhanced code protection 40 year data retention >1,000,000 write/erase cycles >2kv esd protection

[Related Categories: IC Card ]
[Related Keywords: gold, wafer, card ]

Wafer Connectors (12/01/2006)
Features: 1) Insulator body: glass filled PBT UL94V-0 2) Contact material: phosphor bronze 3) Contact plating: nickel or tin plated gold 4) Rated current: 5A 5) Dielectric withstanding: AC 500V (1 minute) 6) Insulation resistance: 1,000mΩ at DC 500V (min.) 7) Contact resistance: 20mΩ (max.) 8) Operating temperature: -55 ~ +120oC 9) Soldering temperature: 260oC (10 seconds max.) 10) Pin space: 3.175mm, 2.54mm, 3.96mm NOXTLON

[Related Categories: Computer Cables & Connectors ]
[Related Keywords: wafer, connectors ]

Wafer Silicon (04/07/2006)
Specifications: Multicrystalline Wafer Specification 1. Material : Multi Crystalline Silicon 2. Technique of Ingot Formation: Casting by Heat Exchange Method 3. Type: P Type due to Boron 4. Resistivity:0.5 to 5.0 Ohm-cm 5. Wafering Technique: Wire Sawing 6. Wafer Shape: Square 7. Wafer Size:125 +/- 0.5mm x 125 +/- 0.5mm 8. Wafer Corners: Chamffered 9. Wafer Thickness: 325 + 25 microns 10. TTV: < 30 microns 11. BOW : < 60 microns 12. Wafer surface Condition As Sawed and Cleaned 13. Saw Mark Depth: < 10 microns 14. Life Time:2 - 8 micro seconds 15. Impurities Carbon: < 5 x 1016 atoms/c. C Oxygen: < 1 x 1018 atoms/c. C Please ask for price and spec and more materials Stock Available till this weekend to close the deal Looking to hear your further advice! OEM Other Price Terms: FOB base Payment Terms: L/C,T/TSupply Ability: 50,000 - 100,000 pcs

[Related Categories: Solar Cells, Solar Panel ]
[Related Keywords: wafer, Silicon ]

Wafer Cell (03/30/2005)
Specifications: Efficiency eff (%) 16.50-16.74 Power ppm (w) 2.56-2.59 Max. Power current ipm (a) 5.04 Min. Power current ipm (a) 4.89 Short circuit current isc (a) 5.46 Max. Power voltage vpm (v) 0.510 Open circuit voltage voc (v) 0.612 Efficiency eff (%) 16.50-16.74 "the average efficiency is 16.25%. And, the lowest efficiency is 15.25%. " Data under standard testing conditions (stc) 1000 w/m2, am1.5,25 Dimension 125 mm x 125 mm 0.5 mm Front blue silicon nitride antireflection coatings1.5 mm silver bus bar Back full - surface aluminum back-surface field ----------------------------- Please ask for price and spec more material 125mm. Or 156 mm. Stock Available till this weekend to close the deal Looking to hear your further advice! Other Price Terms: FOB base Payment Terms: L/C,T/TSupply Ability: 40,000 - 100,000 pcs

[Related Categories: Solar Cells, Solar Panel ]
[Related Keywords: wafer, cell ]

Zinc Wafer For Battery (08/11/2005)
Specifications: We can supply many kinds of zinc wafer For battery(includinghexagon zinc wafer), zinc barrel, zinc flake and zinc belt Etc..WESTLAKE

[Related Categories: Others ]
[Related Keywords: zinc, wafer, Battery ]

Autoclaves, Wafer Chuck, Leak Tester, HAST, Wet Benches (07/10/2006)
Specifications: Universal (Far East) Pte Ltd, a subsiary of Trio-Tech International manufactures the following equipment for the smeiconductor and electronics industries for more than 30 years. HAST, Centrifuge, Autoclaves, Temperature-Controlled Wafer Chuck, Components Leak Testers, Wet Benches We are committed to providing customer with nothing but the best. For more information, please conact Universal (Far East) Pte Ltd.

[Related Categories: Others ]
[Related Keywords: autoclaves, wafer, Chuck, leak, tester, HAST, wet, benches ]

Silicon Wafer, Silicon Ingot (06/10/2005)
Specifications: Silicon is the building block for semiconductor industry. We are presenting our principles for marketing and distributing silicon wafer to oversea customers.

[Related Categories: Integrated Circuits ]
[Related Keywords: Silicon, wafer, Silicon, ingot ]

Semiconductor Wafer Cassette / Slot Magazine / Daisy Chain Wafer (05/24/2005)
Specifications: We sell semiconductor accessaries like : - 6/8" Wafer Cassette - Manual wafer Mounter for 6/8" wafer - Slot magazine - Daisy Chain Wafer, O/S feasibe die.

[Related Categories: Semiconductors ]
[Related Keywords: Semiconductor, wafer, cassette, slot, magazine, daisy, chain, wafer ]

Sapphire Wafer (12/06/2006)
Specifications: Sapphire is a single crystal form of aluminium oxide (al2o3). It is hard, chemically inert, with thermal stability, wide light transmission range and good dielectric parameters. These characteristics make it an ideal material for variety of applications such as LED and laser diodes as well as optical and mechanical components. Wafers & ingots: A, c, R - plane orientation, diameter up to 3 inch A, M - orientation of base plane Custom thickness available for wafers About 70mm length for ingots

[Related Categories: Semiconductors ]
[Related Keywords: sapphire, wafer ]

Sapphire Wafer, GaAs Wafer, Wafer Reclaim (04/30/2005)
Specifications: Sapphire Wafers Epistone provides 2 inch Epi-ready sapphire wafers. Single-side or double-side Epi-ready polishing, thickness at 430um,330um, and 220um ultra-thin wafers are available. Please click here for specification and details. Wafers Reclaim Epistone can save your money through wafers reclaim. We reclaim sapphire and GaAs wafers. The wafers will be repolished, then our customer can reuse them for varied applications. You'll save up to 50% on the cost. The cost savings to our current customers is tremendous over buying new wafers. GaAs Epi/Test Grade Wafers Epistone offers 2 to 6 inch Epi/Test grade GaAs wafers. Semi-insulting and Semi- conductance, single-side and double-side epi-ready polishing wafers are available. Please click here for listed specifications

[Related Categories: Semiconductors ]
[Related Keywords: sapphire, wafer, GaAs, wafer, wafer, reclaim ]

Single Crystal Silicon Wafer (03/13/2005)
Specifications: Pseudo -square single crystalline silicon wafer (for solar use) Specifications: Growing method: Cz Type/dopant: P-type/boron Orientation: (100) +/-3 deg. Resistivity:0.5-3.0 ohm. Cm or 3.0 - 6.0 ohm. Cm Oxygen content: 10 us Dimensions: Pseudo-square dimensions:126 x126+/-0.5mm or 125x125+/-0.5mm Diameter:151.0+/-1.0mm or 150.0+/-1.0mm R-plane length:18.50-23.00mm Angle:90+/-3 deg. Thickness:240+/-20 um (quantities with "+tolerance" should be more than "-tolerance") Bow:70 um ttv:40 um Appearance: Chip: Length and depth

[Related Categories: Semiconductors ]
[Related Keywords: single, crystal, Silicon, wafer ]

Wafer For LED Chip (11/08/2006)
Specifications: 2" epi-wafer for high power LED chip.

[Related Categories: Semiconductors ]
[Related Keywords: wafer, LED, chip ]

Silicon Wafer (03/31/2005)
Specifications: Goods Name: CZ Silicon single crystal Diameter:2,3,4,6 inch Type: N type, P type Orientation: , , Ingot, cutting, lapping and S/D side Polished wafer can be supplied and Please to contact with us for more details. Payment Terms: L/C,T/T Certification(s): ISO9001

[Related Categories: Semiconductors ]
[Related Keywords: Silicon, wafer ]

Wafer Carrier (07/17/2006)
-wafer carrier 25 capacity 125mm w/carrier with semi standard specification and various designs as per customer requirements. Material is characterized by abrasion resistance, low particle generation, dimension stability, chemical & thermal resistance SJW/CARRIER

[Related Categories: Semiconductors ]
[Related Keywords: wafer, carrier ]

Sapphire Wafer (04/11/2006)
Specifications: Sapphire Wafers (Sapphire Substrates) Epistone provides 2 inch Epi-ready sapphire wafers, which used for blue LED substrate. Single-side or double-side Epi-ready polishing, thickness at 430um, 330um, and 220um ultra-thin wafers are available. Please visit our website

[Related Categories: Semiconductors ]
[Related Keywords: sapphire, wafer ]

VB-GaAs Wafer (01/19/2005)
Specifications: Goods Name:VB-GaAs wafer Diameter:2,3 inches Dopant:Si,Cr Orientation:, Cutting and S/D side polished wafer can be supplied and more details please to contact with us. Other Price Terms: FCA Tianjin Payment Terms: T/T Certification(s): ISO9001Supply Ability: 1-500 pcs per month

[Related Categories: Semiconductors ]
[Related Keywords: VB-GaAs, wafer ]

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