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Technical description:layer:14materialFR4 tg170Board thickness: 5.0mmSurface finishimmersion goldMin through hole0.3mm(12mil)Min line width0.1mm4mil)Min line space0.1mm(4mil)Special requirementsRoHS Product use: other
H.C.C. International Limited speacial manufacturer in the line of HDI PCB, PCB boards, FPC, PCBA etc. Our production ability is following:
Layer:
1 -40 Layer
Material:
FR-4
CEM 1 & 2
High Tg
Metal Core
Soldermask: Green, White, Red, Blue, Yellow, Black etc.
Board Thickness: 0.21-7.0mm
Cooper Size: 0.5OZ-7OZ
Max. width of conductor trace line: 3mil
Min. Space of conductor trace line: 3mile
Support format of files: Gerber file and relative drilling files, PROTEL system, PADS 2000, POWER PCB system, CAM 350
Test: 100% E-test, high-pressure Test, Impedance Measurement, Resistor of hole Test, Microsection Analysis etc.
We can manufacture various kinds of rigid circuit boards ,such as single side board,double sides board,and multi layers boards, or immersion gold board , plating gold board , HAL ROHS board and so on.my email:bluesky20050620 at 163 dot com
Single-sided board
Double-sided board Base Meterial: FR-4 Board Ply (thickness): 1.6mm Measurement: 196.85mm*196.85mm Conductor Width: 8mil (0.2mm) Conductor Spacing: 8mil (0.2mm) Minimal Aperture: 0.9mm SurfaceTreatment : HAL (Hot Air Leveling ) Through Hole : 36mil(0.9mm)
Our Capability: Layer:1-20 layers Material:FR4,CEM1,CEM3,FR2, Aluminium base Copper Thickness:1/3OZ-4OZ Board thickness:0.15-3.2mm Min line width/spacing:0.1/0.1mm Min drilling hole size:0.20mm Advanced Technologies: Blind/Buried Via, HDI Micro via Surface Finishing:HAL,HAL(Lead-free),Gold plating,Immersion Gold/Sliver/Tin,ENIG,OSP Certificates:ISO9001,UL,ROHS Price: Quite competitive especially for orders in huge quantities Advantage: Good quality with reasonable price; quick delivery; without limitation for the ordering qty.
Base Meterial: FR-4 Board Ply (thickness): 4.0mm Measurement: 508mm*457.2mm Conductor Width: 10mil (0.25mm) Conductor Spacing: 10mil (0.25mm) Minimal aperture: 1.2mm SurfaceTreatment : HAL (Hot Air Leveling ) Through Hole: 48mil (1.20mm)
High Frequency board Basic Meterial: Telon Board Ply (thickness): 0.8mm Measurement: 4.5mm*7.5mm Conductor Width: 10mil (0.25mm) Conductor Spacing: 10mil (0.25mm) SurfaceTreatment:soft Gold plating File Format: Gerber File (RS274X) Through Hole: 36mil (0.9mm) Our Capability: Layer:1-20 layers Material:FR4,CEM1,CEM3,FR2, Aluminium base Copper Thickness:1/3OZ-4OZ Board thickness:0.15-3.2mm Min line width/spacing:0.1/0.1mm Min drilling hole size:0.20mm Advanced Technologies: Blind/Buried Via, HDI Micro via Surface Finishing:HAL,HAL(Lead-free),Gold plating,Immersion Gold/Sliver/Tin,ENIG,OSP Certificates:ISO9001,UL,ROHS Price: Quite competitive especially for orders in huge quantities Advantage: Good quality with reasonable price; quick delivery; without limitation for the ordering qty.
8-layer immersion Gold board 8 layers board Basic Material: FR-4 Board Ply (thickness): 1.80mm Measurement: 254mm*304.8mm Conductor Width: 5mil (0.13mm) Conductor Spacing: 5mil (0.13mm) SurfaceTreatment: Immersion gold File Format: Gerber File (RS274X) Through Hole: 22mil (0.55mm)
Impedance board Basic meterial: FR-4 Board Ply (thickness): 2.0mm Measurement: 127mm*139.7mm Conductor Width: 6mil (0.13mm) Conductor Spacing: 6mil (0.13mm) SurfaceTreatment:OSP File Format: Gerber File (RS274X) Through Hole: 25mil (0.6mm)
12 layer super-thick board Basic Material : FR-4 Board Ply (thickness): 4.8mm Measurement: 381mm*355.6mm Conductor Width: 8mil (0.20mm) Conductor Space: 8mil (0.20mm) Surface Treatment::HAL File Format: gerber file (rs274-x) Through Hole: 43mil (1.075mm)
6 layer Gold Finger Board Basic Material: FR-4 Board Ply (thickness): 1.6mm Measurement: 120.65mm*184.15mm Conductor Width: 6mil (0.15mm) Conductor Spacing: 6mil (0.15mm) Surface Treatment: plating gold&gold finger File Format: gerber file (rs274-x) Through Hole: 25mil (0.65mm)
Thick nickel-aurum aluminum board Board Thickness：0.6mm aperture: 0.4mm Cu thickness: 1/1 oz Au thickness :0.2um impedance: / Apply: communication equipment conductor spacing: 5mil Base Material : Aluminum-substrate Surface Treatment : Plating gold Remark: Thick AU (AU>0.2UM)
