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Single-sided board
Double-sided board Base Meterial: FR-4 Board Ply (thickness): 1.6mm Measurement: 196.85mm*196.85mm Conductor Width: 8mil (0.2mm) Conductor Spacing: 8mil (0.2mm) Minimal Aperture: 0.9mm SurfaceTreatment : HAL (Hot Air Leveling ) Through Hole : 36mil(0.9mm)
Our Capability: Layer:1-20 layers Material:FR4,CEM1,CEM3,FR2, Aluminium base Copper Thickness:1/3OZ-4OZ Board thickness:0.15-3.2mm Min line width/spacing:0.1/0.1mm Min drilling hole size:0.20mm Advanced Technologies: Blind/Buried Via, HDI Micro via Surface Finishing:HAL,HAL(Lead-free),Gold plating,Immersion Gold/Sliver/Tin,ENIG,OSP Certificates:ISO9001,UL,ROHS Price: Quite competitive especially for orders in huge quantities Advantage: Good quality with reasonable price; quick delivery; without limitation for the ordering qty.
Base Meterial: FR-4 Board Ply (thickness): 4.0mm Measurement: 508mm*457.2mm Conductor Width: 10mil (0.25mm) Conductor Spacing: 10mil (0.25mm) Minimal aperture: 1.2mm SurfaceTreatment : HAL (Hot Air Leveling ) Through Hole: 48mil (1.20mm)
High Frequency board Basic Meterial: Telon Board Ply (thickness): 0.8mm Measurement: 4.5mm*7.5mm Conductor Width: 10mil (0.25mm) Conductor Spacing: 10mil (0.25mm) SurfaceTreatment:soft Gold plating File Format: Gerber File (RS274X) Through Hole: 36mil (0.9mm) Our Capability: Layer:1-20 layers Material:FR4,CEM1,CEM3,FR2, Aluminium base Copper Thickness:1/3OZ-4OZ Board thickness:0.15-3.2mm Min line width/spacing:0.1/0.1mm Min drilling hole size:0.20mm Advanced Technologies: Blind/Buried Via, HDI Micro via Surface Finishing:HAL,HAL(Lead-free),Gold plating,Immersion Gold/Sliver/Tin,ENIG,OSP Certificates:ISO9001,UL,ROHS Price: Quite competitive especially for orders in huge quantities Advantage: Good quality with reasonable price; quick delivery; without limitation for the ordering qty.
8-layer immersion Gold board 8 layers board Basic Material: FR-4 Board Ply (thickness): 1.80mm Measurement: 254mm*304.8mm Conductor Width: 5mil (0.13mm) Conductor Spacing: 5mil (0.13mm) SurfaceTreatment: Immersion gold File Format: Gerber File (RS274X) Through Hole: 22mil (0.55mm)
Impedance board Basic meterial: FR-4 Board Ply (thickness): 2.0mm Measurement: 127mm*139.7mm Conductor Width: 6mil (0.13mm) Conductor Spacing: 6mil (0.13mm) SurfaceTreatment:OSP File Format: Gerber File (RS274X) Through Hole: 25mil (0.6mm)
12 layer super-thick board Basic Material : FR-4 Board Ply (thickness): 4.8mm Measurement: 381mm*355.6mm Conductor Width: 8mil (0.20mm) Conductor Space: 8mil (0.20mm) Surface Treatment::HAL File Format: gerber file (rs274-x) Through Hole: 43mil (1.075mm)
6 layer Gold Finger Board Basic Material: FR-4 Board Ply (thickness): 1.6mm Measurement: 120.65mm*184.15mm Conductor Width: 6mil (0.15mm) Conductor Spacing: 6mil (0.15mm) Surface Treatment: plating gold&gold finger File Format: gerber file (rs274-x) Through Hole: 25mil (0.65mm)
Thick nickel-aurum aluminum board Board Thickness:0.6mm aperture: 0.4mm Cu thickness: 1/1 oz Au thickness :0.2um impedance: / Apply: communication equipment conductor spacing: 5mil Base Material : Aluminum-substrate Surface Treatment : Plating gold Remark: Thick AU (AU>0.2UM)